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- The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface. 采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。
- In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM. 另外，由于芯片倒装焊接的三种关键支撑技术的发展在很大程度上影响着MCM中倒装焊接技术的普及应用，本文还对三种支撑技术进行了研究。
- MCM Flip Chip Bonding Technology Research MCM中倒装焊接技术研究
- Formation of circle band interface of thermosonic flip chip bonding 热超声倒装键合环状界面的形成
- Flip Chip Bond Technique Related to CMOS SEED Smart Pixels 与CMOS-SEED灵巧象素相关的倒装焊工艺
- Multimode vibration analysis of transducer in thermosonic flip chip bonding 热超声键合换能系统振动多模态分析
- Flip chip bonding technology used in modern micro-photoelectron package 现代微光电子封装中的倒装焊技术
- Study on Thermosonic Flip Chip Bonding under Pressure Constraint Pattern 压力约束模式下热超声倒装键合的试验
- Keywords thermosonic flip chip bonding;bonding process monitoring;vibration propagation;bonding mechanism;bonding reliability;novel TSFC bonding process;atom diffusion; 热超声倒装键合;键合过程监测;运动传递;键合机理;键合强度;键合可靠性;新型倒装键合工艺;原子扩散;
- flip chip bonding 倒装焊接
- Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
- thermosonic flip chip bonding 热超声倒装键合
- flip chip bonder 倒装焊接机
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
- High viscosity, thixotropic paste for wire tacking, chip bonding and coil terminating. 高粘性,触变膏体,用于导线定位、片结合、线圈终端。
- The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
- Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 采用通用有限元软件MSC.
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。
- Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. 倒装芯片是一种性能价格比良好的互连技术 ,要求采用富有创新的操作 ,以满足KGD的测试方法和操作工艺的需要。
