In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.

• 另外，由于芯片倒装焊接的三种关键支撑技术的发展在很大程度上影响着MCM中倒装焊接技术的普及应用，本文还对三种支撑技术进行了研究。