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- Sn3.0Ag0.5CuCe钎料 Sn3.0Ag0.5CuCe solder
- Sn3.5Ag0.5Cu钎料 Sn3.5Ag0.5Cu solder
- Sn3.5AgO.5Cu钎料 Sn3.5Ag0.5Cu solder
- 钎料 brazing filler metal
- 利用周模型对Sn-Ag-Cu-Ce无铅钎料合金体系进行了热力学计算预测。 Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model.
- 理查德钎料 Richard's solder
- 铝钎料 Almit
- 结果表明:Zn与Ag、Cu形成AgZn和CuZn3化合物,能显著细化Sn3.5Ag0.5Cu钎料组织,降低Sn3.5Ag0.5Cu钎料合金的润湿性,同时可提高Sn3.5Ag0.5Cu钎料合金抗拉强度。 The results show that Zn and Ag ? Cu can form the AgZn and CuZn3 compound and the microstructure of Sn3.5Ag0.5Cu solder is refined at the same time. Morever,the wettability of the Sn3.5Ag0.5Cu lead-free solder is reduced and its tension strength is improved by adding elements Zn in Sn3.5Ag0.5Cu solder.
- 钎料丝 solder wire
- 铅钎料 lead solder
- 软钎料 low melting solder
- 钎料层 filler metal layer
- 3P1钎料 3P1 brazing alloy
- 镍基钎料 Nickel base brazing filler metals
- 锡钎料 tin solder
- 钴钎料 cobalt braze
- 锌钎料 spelter solder; brazing brass
- 银钎料 silver-brazing alloy
- 硬钎料 hard solder
- 用铝基钎料钎焊SiC陶瓷及其在SiC陶瓷表面浸润性的研究 Study on Brazing of SiC Ceramics with Aluminum base Filler Metals and Their Wettability on the Surface of SiC Substrates
