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- Sn3.5Ag0.5Cu钎料 Sn3.5Ag0.5Cu solder
- 结果表明:Zn与Ag、Cu形成AgZn和CuZn3化合物,能显著细化Sn3.5Ag0.5Cu钎料组织,降低Sn3.5Ag0.5Cu钎料合金的润湿性,同时可提高Sn3.5Ag0.5Cu钎料合金抗拉强度。 The results show that Zn and Ag ? Cu can form the AgZn and CuZn3 compound and the microstructure of Sn3.5Ag0.5Cu solder is refined at the same time. Morever,the wettability of the Sn3.5Ag0.5Cu lead-free solder is reduced and its tension strength is improved by adding elements Zn in Sn3.5Ag0.5Cu solder.
- Sn3.5AgO.5Cu钎料 Sn3.5Ag0.5Cu solder
- Sn-3.5Ag-0.5Cu钎料 Sn-3.5Ag-0.5Cu solder
- 来料 supplied materials
- 调味料 flavouring
- 料号
- 领料单 call slip
- 出料 discharge port
- 上料 loading
- 缺料 starved feeding
- 主料 mother stock
- 钎料 brazing filler metal
- 铝钎料 Almit
- 钎料丝 solder wire
- 铅钎料 lead solder
- 软钎料 low melting solder
- 钎料层 filler metal layer
- 钛基钎料 Ti-based brazing materials
- Zn-Al钎料 Zn-Al solder
