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- IC封装 IC package
- 超薄型IC封装技术 packaging for ultra-thin ICs
- IC封装的扩晶装置结构设计 Structural Design of Wafer Expansion Device for IC Encapsulation
- HDI和IC封装用高性能覆铜板的开发 The Development of High Quality CCL for HDI and IC Package
- IC封装设备划片机的研制 Development of Wafer Incision Machine for IC Encapsulation
- IC封装热压模机合模机构设计与有限元分析 Design and Finite Element Analysis for Clamping Unit of Auto Molding in IC Packaging
- 本产品是为IC封装自动贴片机及其贴片工艺而设计。 This product design for IC assembly die bonding process on die bonder machine.
- IC卡 IC-card
- TCP封装 TCPencapsulation
- TO封装 TO packaging
- IC门 IC
- 铝封装 aluminum encapsulation
- IC法 IC method
- 封装变化 Find what varies and encapsulate it
- UDP封装 UDP encapsulation
- 模拟IC analog IC
- 控制IC control IC
- 封装胶 encapsulation
- 3D封装 3D package
- IC设计 IC design