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- 3D堆叠式封装 3D chip stacked packages
- 拟3D pseudo-3D
- TCP封装 TCPencapsulation
- TO封装 TO packaging
- 3D模型 3D model
- 3D-CTA 3D-CTA
- 铝封装 aluminum encapsulation
- 封装变化 Find what varies and encapsulate it
- 3D成像 3D imaging
- 3D测量 3D measurement
- UDP封装 UDP encapsulation
- IC封装 IC package
- 3D-ICT 3D-ICT
- 3D扫描 3 D scanning
- 封装胶 encapsulation
- 3D封装 3D package
- 3D重构 3D reconstruction
- 3D分割 3D segmentation
- CSP封装 CSP package
- LED封装 LED packaging
