The resulting benefits are high stiffness and load bearing at low weights and with low warpage. 最终带给产品的好处是在低重量和低翘曲情况下体现出的高刚性和承载能力。
To understand the mechanics of wafer warpage, research is performed on the effect of the lift-off procedure and material thickness on wafer warpage. 本研究进一步为了解晶圆翘曲的力学特性,研究雷射剥离过程及材料厚度,对氮化镓发光二极体晶圆翘曲之影响。