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- Heat stability is more evident with solder paste. 焊锡膏的热稳定性就更为明显。
- Stir solder paste in container before use. 使用时搅拌容器内的焊膏。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- The use of nitrogen will depend on the solder paste flux chemistry. 是否使用氮气取决于焊锡膏焊剂的化学特性。
- Is the sequence of Solder Paste height measurements defined? 锡膏厚度的测量顺序是否指定?
- Is the average and range of Solder Paste height measurements SPC controlled? 锡膏厚度测量的平均值和间距SPC是否受控?
- What are the main qualification tests for using lead-free solder paste? 使用无铅焊锡膏的主要评选测试有哪些?
- RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste. RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。
- The operator should use the solder paste quickly after it has been taken out. 取出的锡膏要尽快实施印刷使用。
- The right choice of the most suitabele soldering paste is essential for an ideal and stable soldering result. 为了要达到理想又稳定的焊锡效果，选择合适的锡膏是决定性的因素。
- Are LCD's and UCLA's defined for the average and range of Solder Paste measurements? 对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?
- Is the upper and lower specification limits for individual Solder Paste height measurements also defined? 单点锡膏厚度测量是否定义了其控制上限和下限?
- This paper proceeded the analysis for the problems that appear in actual application of the soldering paste, which is of some value to SMT technicians. 作为新兴技术,在实际应用中总存在一些问题,就其使用的焊锡膏在实际应用中出现的问题进行了分析,供从事SMT人员借鉴。
- Solder paste is essential material in SMT, which is widely used in reflow soldering. 焊膏是SMT工艺中不可缺少的钎焊材料,广泛应用于再流焊中;
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
- Do not touch solder paste bare-handed. Remove with ethyl alcohol from body or clothes if contaminated by solder paste. 小心使用焊膏,避免触及皮肤。若附于衣服或身体时,应尽快用含有酒精的溶剂把焊膏抹掉。
- TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable. TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。
- Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste. 回流焊:应用加热金属涂敷层的表面和预涂焊膏,熔融,连接和凝固两个金属涂层。
- Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester. Northrop Grumman公司宣布由凯斯特推出FL250D免清洗焊锡膏。
- Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester. Northrop Grumman公司宣布,PureMark 202免清洗焊锡膏已由凯斯特推出。
