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- chemical bonding process 胶结工艺
- Tending to attract electrons to form a chemical bond. 负电极的有吸引电子以形成化学键的倾向的
- What's the nature of chemical bond? 什么是化学键的本质?
- A chemical bond or link created by cross-linking. 交键通过交联形成的化学键
- Are the ambient conditions controlled for the bonding process? 周围是情况吗受约束的为会接程序?
- Tending to release electrons to form a chemical bond. 有释放电子以形成化学键倾向的
- We seem to be considering chemical bonding solely in terms of potential energy. 我们似乎只用势能来考虑化学成键。
- IR spectrum showed that the chemical bond was formed between PU and EP. 傅立叶红外光谱分析显示出了环氧树脂与水性聚氨酯之间存在化学键的连接。
- Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding. 13.;3节的内容既涉及热压连接工艺本身;也涉及了自动连接的传送带技术。
- In this paper, research results and disadvantages of main bonding process of zircaloy and stainless steel are reviewed. 分析了核反应堆用锆合金与不锈钢主要连接技术的研究结果及存在的问题。
- Let us consider the implication of the electrostatic theorem for chemical bonding in diatomic molecules. 让我们讨论双原子分子化学成键所蕴含的静电定理。
- Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding . 3节的内容既涉及热压连接工艺本身,也涉及了自动连接的传送带技术。
- The results also show that there are two bonding mechanisms in the bonding process. 同时研究还表明:在轧制复合过程中存在着两种结合机理。
- A chemical bond. 化学黏合剂
- Matthew: Brushing is a actually obviously been epical for him and it's a bonding, part of the bonding process. 马修:很显然,这种梳理对它大有裨益,同时也是我们建立良好关系的一部分。
- Being a noble gas, it resists chemical bonding with other elements and is thus easy to purify for isotopic analysis. 由于氙是惰性的,不易与其他元素产生化学键,因此很容易纯化以进行同位素分析。
- The Bonding Process of Mothers to Their Premature Newborns Through Videotape - Liu K. Y. , Chin C. C. , Lo L. H., &Chou, F. H. 母亲透过录影带蕴育其与早产新生儿之依附关系的经验历程-刘冠吟,金继春,骆丽华,周泛澔
- Nanotubes are stronger than metal because the chemical bond holding them together is stronger. 纳管之所以比金属硬,是因为把碳原子连在一起的化学键更强。
- During the dissolution diffusion bonding process, control of the heat is important to improve well cutability, besides using special alloy powder. 在铸件液膜溶解扩散焊修复工艺中,为保证修复部位良好的加工性能,除采用特制的合金粉末材料外,热过程的控制也是重要的因素。
- Evolve new theoretical approaches to understand chemical bonding and reactions and to test these. 发展关于化学键和反应的新的理论方法,并且通过真实的化学体系来检验它们。