该词条未找到_海词词典

您要查找的是不是：

In the IC packaging and testing has seen a typical phenomenon, a roaming from start to finish, not used by ordinary attacks, all the skills to use. 在封测曾经见到过一个典型现象，一个漫游从开始到结束，没用过普通攻击，全是用的技能。
Focus on the stability of sub-industries performance, the IC design industry has minimum volatility, secondary is lead-frame, photomask and IC packaging and testing industries. 四、子产业绩效表现之稳定性，以IC设计业的波动最小，其次为导线架业、光罩业及IC封装测试业；
Amkor Technology try to be the leading innovator in the IC packaging and test industry supporting the most successful semiconductor companies in the world. 公司致力于IC封装测试业的领先者和创新者，支持世界上大多数成功的半导体企业。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems. 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
It discusses not only a kind of new Vacuum Jointing Process in IC Packaging but also its theory and background. Besides, it enumerates the remarkable achievements by implementing this process. 摘要论述了在集成电路生产中一种新的真空烧结工艺，讨论了它的理论依据及产生背景，并列举了通过实行该工艺所带来的显著成绩。
The Voice Coil Motor (VCM),which characterized as small inertia,high frequency response and fast convergence, is widely applied in high precision motion control in IC Packaging device. 音圈电机是一种广泛应用于IC装备的高精度驱动元件,具有小惯量,高频响,以及收敛快的控制特性。
Coplanarity Problems of IC Packaging 集成电路封装的共面性问题
Flip Chip (FC) technology, which is widely used in IC packaging, is introduced into the fabrication of three-dimensional packaged integrated power electronics module ( IPEM ) to construct Flip Chip IPEM (FC- IPEM). 倒装芯片(Flip Chip,FC)技术广泛应用于微电子封装中,将该技术引入到三维的集成电力电子模块(Integrated Power Electronics Module,IPEM)的封装中,可以构成倒装芯片集成电力电子模块(FC-IPEM)。
Navin Bhandarkar,Lim Thiam Beng,1996,”Low-Stress Leadfram Design for Plastic IC Package ”, IEEE Electronic Component and Technology Conference, pp.803-807. 黄俊琦,2003年,”薄型电子构装晶片应力分析与晶片可靠性设计研究”,国立云林科技大学机械工程所硕士论文。
Chien, C.H., Weng, D.J., Chiou, Y.T., Tsai, M.L. and Chen, Y.C., 2002, "The Effect of Moisture on the Interfacial Adhesion of IC Packages," International Symposium on Experimental Mechanics, Taipei, Taiwan, pp. 1-6. 钱志回、谢其昌、陈永昌、吴以德、周业兴、杨世豪、蔡宗宪、许呈宇，2002，?接合填充胶/防焊漆/基板经温度循环黏著强度之研究?，第二十六届全国力学会议，云林，第1-11页。
Design and Finite Element Analysis for Clamping Unit of Auto Molding in IC Packaging IC封装热压模机合模机构设计与有限元分析
Experience and Exploration of the Energy-Saving Operation in IC Packaging Industry 集成电路封装行业动力节能运行实践经验与探讨
The special packaging will run up the price of the item. 这种特殊包装会抬高这种商品的价值。
Keywords microelectronic plating;semiconductor;IC packaging;micro-bumps;multichip modules;microelectronics mechanical system; 微电子镀覆;半导体;IC封装;凸点;多芯片组件;微电子机械系统;
High Frequency IC Package Design Based on QFP Lead Frame 基于QFP技术的高频集成电路封装设计
Now IC card telephones have come into use. 现在IC卡电话已投入使用。
Analysis of Internal Void and External Void of IC Packages 集成电路封装制品中气孔气泡问题的分析
The Development of Epoxy Molding Materials for IC Packages 集成电路封装用树脂材料的发展动向
International Packaging Leasing Corporation Ltd. 国际包装租赁有限公司
I like the packaging which is novel and attractive. 我喜欢新颖美观的装潢。