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- Cu互连工艺中Ta基扩散阻挡层的二次离子质谱剖析 Analysis of Ta-based Barrier Layer of Cu-interconnect by Second Ion Mass Spectrometry
- Al-Cu互连 Al-Cu interconnect
- 互连 interconnection
- Al／Cu Al/Cu
- Cu-Al合金 Cu-Al alloy
- Cu互连 Cu metallization
- Al-Cu共晶 Al-Cu eutectic
- Cu-Al-Mn Cu-Al-Mn
- Cu互连线 Cu interconnects
- Al-Cu-Fe AI-Cu-Fe
- Cu大马士革互连 Cu Damascene interconnects
- Al-Cu铸件 Al-Cu casting
- Al-Cu-Mg-Ag Al-Cu-Mg-Ag
- Al-4%Cu合金 Al-4%25Cu alloy
- Al-Zn-Mg-Cu Al-Zn-Mg-Cu
- Cu-Al-Y合金 Cu-Al-Y alloy
- Al-Cu扩散偶 Al-Cu couple
- Al-Cu-Fe-B Al-Cu-Fe-B
- Al-Si-Cu-Zn Al-Si-Cu-Zn filler metal
- Al基Cu薄膜 Al-based Cu film
