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- 电镀Ni（Bi） electroplating Ni(Bi)
- 电镀Ni electro-deposited nickel
- 电镀 galvanization
- 研究了电镀Ni层和化学镀Ni P合金层对Sn Ag/Cu焊点扩散行为的影响 ,电子探针分析表明 :化学镀Ni P合金层能很好地阻止Sn Ag/Cu焊点在焊接过程中的Cu ,Sn互扩散和相互反应 ; The effects of electroplated Ni layer and electroless plated Ni P layer on the diffusion behavior in Sn Ag/Cu solder joint were studied. The results by EPMA analysis showed that the electroless plated Ni P layer acted as a good diffusion barrier between Sn Ag solder and Cu substrate.
- BI-1 BI-1
- 电镀的 electroplating
- Bi相 Bi Phase
- 富Bi Bi excess
- Ni-P Ni-P
- Bi元素 bismuth element
- 电镀液 plating solution
- 7-NI 7-Nitroindazole
- Bi-补偿 bistatic compensation
- Ag-Ni Ag-Ni
- BI废水 BI organic wastewater
- 电镀槽 plating bath
- 镀Ni nickel plated
- Bi薄膜 Bi film
- 电镀铰链 a galvanized hinge
