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- 叠层3D封装技术 stacked 3D packaging technology
- 叠层封装 Multi-Stack package
- 层 layer
- 采用新型多层基板的多芯片组件封装技术 Packaging Technology for Multichip Module Using New Type Multilayer Substrate
- 叠层芯片封装 stacked die package
- 连续叠层技术 non stop lamination
- 敞开式、错叠层、大跨度预应力板柱体系停车楼建筑技术研究应用 Architectural Techniques Study and Application of the Open-type and Large Span Storied Garage Building in Split Level with Lamination and Prestressed Slab Column Structure System
- 叠层芯片封装元件 SCSP
- 叠层灰岩 stromatolithic limestone
- 褶叠层 pleat
- 磁叠层 magnetic lamination
- 双叠层 double stacks
- 堆叠层 stack layer
- 上叠层 superimposed layer
- 叠层拱 lamella arch
- 叠层管 stacked tube
- 叠层梁 laminated beam
- 叠层煤 laminated coal
- 叠层木 laminwood
- 叠层学 stromatology
