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flip chip integrated circuit 倒装芯片集成电路
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。
Integrated circuit Flip Chip package 集成电路板叩焊晶片
15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
Lead in solders to complete a viable electrical connection internal to certain Integrated Circuit Packages (Flip Chips) (exemption until 2010), 完成某集成电路封装(叩焊芯片)内部实际的电气连接的焊锡中的铅(准许免除直到2010年)
An integrated circuit that contains the entire central processing unit of a computer on a single chip. 微处理机一个芯片上的包含有一个计算机的全部中央处理组件的集成电路
Die: Integrated circuit chip as diced or cut from a finished wafer. 晶粒:集成电路芯片切块或晶圆成品上的切块。
They consist of a single integrated circuit on a chip. 它们在芯片中包含了一个简单的集成电路。
chip integrated circuit 片状集成电路
one chip integrated circuit 单片集成电路
Flip Chip (FC) technology, which is widely used in IC packaging, is introduced into the fabrication of three-dimensional packaged integrated power electronics module ( IPEM ) to construct Flip Chip IPEM (FC- IPEM). 倒装芯片(Flip Chip,FC)技术广泛应用于微电子封装中,将该技术引入到三维的集成电力电子模块(Integrated Power Electronics Module,IPEM)的封装中,可以构成倒装芯片集成电力电子模块(FC-IPEM)。
As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
This is called the mixed mode integrated circuit. 这称为混合型集成电路。
A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
This is called a hybrid integrated circuit . 这称为混合型集成电路。
The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
VLSI and Application Specific Integrated Circuit ? vlsi原理与专用集成电路设计
Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 采用通用有限元软件MSC.
SOUTHWEST INTEGRATED CIRCUIT DESIGN CO., LTD. 西南集成电路设计有限公司。