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copper foil laminated 铜箔垒层板
Development of high-frequency copper foil laminate modified by poly-p-phenylene dxiae 改性聚苯醚层压式高频覆铜板的研制
Our company is a large joint venture company, mainly produce electrolytic copper foil and copper clad laminated sheet. It has got ISO9002, UL, BSI and China Great Wall Secure recogonition. 简介：本公司是一中外合资大型企业，主要产品有电解铜箔、覆铜板，年产电解铜箔5000吨，覆铜板500万平方米，公司已通过了ISO9002认证。
Uses this product goldfoil, copper foil can not discolorment. 使用本产品金箔、铜箔不会变色。
copper foil laminate 铜箔叠层板
copper foil laminators 覆铜箔板
This company produces copper foil, aluminous foil, gold foil, and silver foil. 本公司专业生产铜箔、铝箔、金箔和银箔。
The Yida Copper Foils Manufacturing Co., Ltd. 亿达铜箔制造有限公司。
Equivalent heat conductivity of PWB is related to the thickness of PWB,the residual ratio of copper foil and the thickness of copper foil. PWB的等效导热系数与PWB的总厚度、铜箔剩余率及铜箔厚度有关,设计时需考虑相关因素。
Copper foil tape with acrylic adhesive for specialty EMI/RFI shielding and protection. 铜箔，无导电性压克力胶系，适合用于EMI/RFI遮蔽，可焊锡。
Then, the thickness of copper foil and strand diameter of Litz wire is discussed to obtain the minimum winding losses. 最后针对最小线损下，探讨铜箔厚度及多股绞线直径之最佳设计尺寸。
When changing Copper Foil spec. (width/ thickness), simply changesthe rollor guider and relevant parts. 铜箔之宽度或厚度变更时;只需更改相关之导轨或配件.
The process flow and conditions of roughening by copper plating for wrought rolled copper foil were introduced. 介绍了压延铜箔镀铜粗化工艺的工艺流程和工艺条件。
Various insulating materials such as electronic shield materials,PVC,film,Mylar,copper foil,aluminum foil,foam,etc. 电子屏蔽材料、PVC、胶片、麦拉纸、铜箔、铝箔、泡棉等多种绝缘材料。
A copper foil solution is used to bond the glass pieces together, and then the pieces are soldered together firmly. 铜箔解决方案可使玻璃碎片结合在一起，然后一起焊接牢固。
The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years. 印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。
The ablation process of copper foil with ultrashort laser pulses was simulated by the double-temperature equation(DTE),which was formatted simply. 使用约化后的双温方程(DTE)对超短激光脉冲烧蚀铜薄层的过程进行了数值模拟;
The ablation processing of copper foil with ultrashort laser pulses was simulated bythe Double-Temperature Equation(DTE), which was formatted simply. 使用约化后的双温方程对超短激光脉冲烧蚀铜薄片的过程进行了数值模拟;
This article mainly tell the process of electrolysis copper foil surface treatment and changes in Electro-plate layer crystalline forms. 本文阐述电解铜箔表面处理工艺过程与镀层结晶形态的变化。
According to Brown, a monolayer material is used for the thermoformed base, while the lidding is a multilayer foil laminate, with no adhesive layer. 据布朗，单层材料是用于热基地，同时封盖是一个多层金属箔层压板，无粘接层。