With the wireless industry pushing towards higher levels of integration,employing more sys-tem-in-a-pack age(SIP)and multi-chip modules(MCM),known-good-die testing of RF-SOC devices has emerged as an im portant test challenge.

• 随着无线通讯产业推动芯片集成度的不断提高,系统级封装(SIP)和多芯片组件(MCM)被更多采用,射频系统级芯片(RF-SOC)器件的良品测试已成为一大挑战。