With the raise of pH value of electroless nickel plating solution, content of phosphorus in deposit was lowered, and moreover, Ni(OH)_2 was probably precipitated and mingled with Ni-P deposit which resulted in ascension of resistance.

• 化学镀镍溶液pH值升高,镀层磷含量降低,同时可能生成Ni(OH)2沉淀夹杂在镀层中,从而使电阻升高;