With the increase of ICs speed, the power/ground voltage bounces on the power gound planes pair of the multi chip module becomes the bottleneck of the development of high speed ICs.

• 摘要电源接地板上的同步开关噪声是制约高速电路发展的瓶颈，而目前同步开关噪声分析集中于规则电源接地板，与实际电路有一定差距。