Uniformity of the photoresist film, adhesiveness between underlay and glue film, exposal and develop condition of high thickness difference are all solved in the thesis.

• 在厚胶光刻工艺中重点解决了胶膜厚度的均匀性、胶膜与衬底的粘附性、大厚度差胶层的曝光、显影条件等的优化问题。