To ease on-chip integration and SIP (silicon intellectual property) reuse, three CMOS time domain smart temperature sensors and one CMOS time domain thermostat are presented in this dissertation.

• 以可轻易地实现内建晶片积体化与可重复矽智财为目标，本论文发表了三种互补式金氧半之时域智慧型温度感测器与一种时域温度警示调节器。