The type of packages and the methods in which it is possible to mount the finished semiconductor chip(depending on factors such as heat dissipation, size, etc.Packages canbe plastic, ceramic, Cer - DIP, or other type.

• 封装的类型和方法（它们取决于热耗散和尺寸大小等因素），用此种方式即可安置经过精制的半导体芯片。封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。