The type of packages and the methods in which it is possible to mount the finished semiconductor chip(depending on factors such as heat dissipation, size, etc.). Packages canbe plastic, ceramic, Cer-DIP, or other type.

• 封装的类型和方法（它们取决于热耗散和尺寸大小等因素），用此种方式即可安置经过精制的半导体芯片。封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。