The structure, microhardness change and element change in the zone of bonding interface were studied by means of metallograph, SEM, microhardness and EPMA, etc.

• 采用金相、扫描电镜、显微硬度及电子探针显微分析等手段对结合界面区域的组织结构、显微硬度变化及元素扩散进行了研究。