The objective of this thesis is to introduce an alternative temperature sensor in CMOS technology with small area, low power consumption, and high resolution that can be easily interfaced.

• 本文应用数值模拟方法探讨管外不同几何外型构造之凝结热传特性之分析。本研究热传装置包括了水平圆管、波形圆管、椭圆管与超级椭圆管。