The numerical simulation of the fluid flow and the thermal transfer of the above optimized structure shows that the highest temperatures of chips were 358.34 and 361.52 K,respectively,meeting the requirement of the chip for the work temperature.

• 对以上得到的优化结构的微槽冷却热沉的流体流动和传热进行了数值模拟；得到芯片的最高温度分别为358.；34 K和361