The model of the ITR between AlN and Cu is built by using the Acoustic Mismatch Model, AMM and Diffuse Mismatch Model, DMM.

• 对低温界面热阻进行理论建模主要运用了低温物理学中的声失配理论和散声失配理论对氮化铝（AlN）和铜（Cu）之间的界面热阻进行讨论。