The mechanism of bonding,material of improvement bonding and the evaluation method of bonding strength are summarized. The development of this technology which used in MEMS is expected.

• 对阳极键合技术的机理、键合基片材料的发展以及键合强度的评价方法等方面进行了综述和评价,并对阳极键合技术在MEMS中的发展趋势作出展望。