The influence of an organic complexing agent AD on electrodeposition of Mg-Ni alloy in organic bath on Cu electrode was studied by using cyclic voltammetry and AC impedance methods.

• 通过循环伏安法、交流阻抗法研究了一种有机络合剂对有机镀液中镁-镍合金在铜上共沉积的影响。