The high activity of TSF-6850 improves wetting of Lead Free alloys difficult to solder to substrate finishes including OSP-Cu, ENIG and Immersion finishes.

• 具有高活性的TSF-6850能够提高难于焊接到衬底终饰上的无铅合金(其中包括OSP-Cu、ENIG和浸渍终饰)的湿化特性。