The electron backscatter diffraction technique (EBSD) has been used to measure the microstructure of reactive ion etched(RIE) Al and damascene Cu interconnects, including the grain size, grain orientation and grain boundary characteristics.

• 利用电子背散射衍射(EBSD)技术；测量了由反应离子刻蚀工艺(RIE)制备的Al互连线和大马士革工艺(Damascene)制备的Cu互连线的显微结构；包括晶粒尺寸、晶体学取向和晶界特征.