The diamond and Fullerene abrasive tools with superfine grains were prepared, and the grinding tests on silicon wafer surface was carried out with this two kinds of abrasive tools.

• 制备了超微粒金刚石和富勒烯研磨工具,并分别进行了硅片研磨试验,详细分析了两种材料的研磨特性如表面粗糙度的稳定性、磨料粒度对研磨效果的影响以及研磨材料的显微结构等。