The deformation characteristics of kovar lead and seal ri ng and the copper base are discussed.A suggestion is made on how to improve the design of the base and the reliability of electronic packages.
英
美
释义
文中对可伐引线、密封圈的应变特征及其对铜基板热变形的影响进行了讨论,并提出了改善封装热应力的途径。
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