Stress analysis under dynamic load showed that the equivalent stress in both the die attachment adhesive and the sealing ring adhesive between the chip and the silicon protective cap decreased with the increase in the elastic modulus of potting resin.

• 动态载荷下等效应力分析表明：芯片粘结胶、芯片及其硅盖板之间封接胶环的等效应力随着灌封胶弹性模量(E)的增加而减小；