Refer to related JEDEC standards, some issues for plastic IC - such as moisture sensitive level, packing requirements, SMT reflow profile and reworking - are introduced and discussed.

• 参考JEDEC标准,介绍和讨论塑封IC器件的潮敏问题,如潮敏分级,相应的包装要求,SMT回流焊温度曲线等。