Poor wettability of lead-free solder brings about challenge to present electronic assembly technology.Nitrogen protection can improves wettability of lead-free solder and solder joint quality.

• 无铅钎料差的润湿性给传统电子组装工艺带来了巨大的挑战,氮气保护有利于改善无铅钎料的润湿性,提高焊点质量。