Of these three error sources, it is found that the tilt of the TO-cap has the greatest effect on the coupling efficiency of the packaging subassemblies.
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释义
发现在芯片横向偏移、芯片倾斜和管帽倾斜这三种操作误差中,管帽倾斜对封装组件的耦合效率影响最大。
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