Microelectronic circuits in which the passive components and their metallic interconnections are formed directly on an insulating substrate and the active semiconductor devices(usually in wafer form) are added subsequently.
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释义
一种微电子电路器件,其中的无源元件及内部金属连线直接在绝缘衬底上形成,然后再加上有源半导体器件(通常以大圆片形式给出)。
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