Keywords MMCM;Via;Vertical interconnect;Matrix-penciled Moment Method;Scattering parameter;Microstrip connecting angle;Shielding via;FDTD;Flip-chip;Solder bump;

• 微波多芯片组件;通孔;垂直互连;矩阵束矩量法;散射参数;微带线连接角;屏蔽通孔;时域有限差分法;倒装焊;焊盘;