In this study, this is the first time in Taiwan to combine electron backscattered diffraction and digital image correlation method integrated to determine residual stresses.

• 中文摘要在许多半导体制程中，镀膜与基板长因残留应力而裂开剥落，因此残留应力应变的测量在许多方面的研究上都是一直是重要课题。