In this paper,the possibility of copper direct bonding to aluminum nitride substrate is studied,and the bonding mechanism is investigated by means of SEM and EDX.

• 研究了铜与氮化铝陶瓷直接键合的可行性,运用扫描电镜(SEM)、电子能谱(EDX)对键合机理作了一定的分析和探讨。