In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs.

• 摘要结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求，介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景，其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。