In order to study the applicability of Transient Liquid Phase(TLP) bonding method to Cobalt-based superalloy K640,the bonding test adopting amorphous interlayer was carried out.

• 为考察瞬时液相(TLP)连接方法对钴基高温合金K640合金的适用性,采用非晶态中间层进行连接试验,观察接头区显微组织,测试接头的力学性能并进行断口分析。