In modern VLSI designs, the thermal problem is more and more important. Unsmooth distributed temperature will affect upon the reliability of circuits and become the performance bottleneck.

• 现今超大型积体电路设计之流程中，关于热度问题越显重要。在晶片中，若是热度无法平均分配于晶片表面的话，将会影响到电路的可靠度，甚至成为晶片效能的瓶颈。