Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.

• 对预热温度、焊料槽温度和焊剂体积进行优化后,还可将传送带速度降低,以适应使用无铅焊料时的熔湿速度。