Good performance in adhesion, High Temperature Resistance, Solvent Resistance, Strong Holding Force, No Residual Adhesive Left. For protecting gold finger in the process of PCB.

• 粘性佳，耐高温、耐溶剂、保持力强、不残胶；用于印刷线路板（PCB）过锡炉喷锡和波峰焊过程中遮蔽保护金手指.