Founding on the testing result, the reliability of driver IC have been analyzed by electromigration, latch up, isolation technology, VDMOS reliability and ESD.

• 针对测试结果对芯片进行了可靠性分析,分析从电迁移现象,闩锁效应,隔离技术,功率器件的可靠性以及静电保护这几部分展开。