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- TiO2-W薄膜 TiO2-W thin films
- 薄膜 film
- 薄膜的 pellicular
- W-Cu触头材料 W-Cu contact materials
- 研究结果表明,在优化的工艺条件下,可获得应力为230 MPa、硬度高达988 HV、无裂纹的纳米晶Ni-W薄膜材料,为其在MEMS微器件、微模具制备上的应用提供了有效途径. The results show that in the optimum process,the nanocrystalline Ni-W film without crack can be obtained,and its stress is 230 MPa,hardness is 988 HV.In this way,Ni-W film may be widely applied in the manufacture of MEMS device and micro-molding.
- 塑料薄膜 plastic membrane
- W／Cu触头材料 W/Cu contact materials
- Cu-Pb-Zn-W-As-Sb-Bi-Au-Ag Cu-Pb-Zn-W-As-Sb-Bi-Au-Ag
- 薄膜开关 thin film switch
- Mo（W）/S/Cu含簇超分子化合物的合成、结构与性能研究 Syntheses, Structures and Properties of Supramolecular Compounds Constructed from the Preformed Mo(W)/S/Cu Clusters
- 薄膜电池 hull cell
- 薄膜材料 thin-film material
- 薄膜袋 bag film
- 薄膜封闭 membrane sealed
- 薄膜晶体管 sistor
- 透镜薄膜 lens blooming
- 薄膜比拟 membrane analogy
- 薄膜厚度 film thickness
- 薄膜层 thin layer
- 薄膜式 diaphragm type servomotor
