Cool down process is found more critical than heat up, due to high in-plane and out-plane stresses that might cause crack initiation,as well as,can accelerate the spallation process of TBCs.

• 冷却要比加热状态危险，因为由于涂层平面内、外应力 综合作用，该状态容易产生裂纹并导致涂层翘曲剥落；