Coalescence and growth through boundary diffusion and Ostwald ripening happen during series annealing at high temperature of copper nanoparticles immersing plating on Si-NPA.

• 浸渍沉积于Si-NPA表面的铜纳米颗粒在高温系列退火过程中发生了由边界扩散和Ostwald熟化导致的团聚生长。