Chemical-Mechanical Polish( CMP)- A process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.

• 化学-机械抛光(mp)-平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。